Solar wafers. Author: Oregon Department of Transportation. License: Creative Commons, Attribution 2.0 Generic
Leading Edge Equipment Technologies, a US company offering a new technology for silicon wafer manufacturing, today announced it has secured USD 7.6 million (EUR 6.4m) in fresh capital.
The Series A financing round was led by Prime Impact Fund, while previous investors Clean Energy Ventures and DSM Venturing also contributed.
The company's technology manufactures kerfless, single-crystal silicon wafers. Its equipment is said to be capable of cutting wafer costs by 50%, boosting commercial solar module power by up to 7% and lowering manufacturing emissions by over 50%.
The new technology reduces the current silicon wafer production process from seven steps to just one, resulting in almost no waste product, according to the statement.
Leading Edge has secured a 31,000 sq ft (2,880 sq m) facility and will use the new funds to prepare for the commercial launch of its technology in 2021.